Institute of Microelectronics Chinese Academy of Sciences Files United States Patent Application for Method for Packaging Semiconductor Structure, Packaging Structure and Chip

Press/Media

Period	Sep 30 2022

Media coverage

Title	Institute of Microelectronics Chinese Academy of Sciences Files United States Patent Application for Method for Packaging Semiconductor Structure, Packaging Structure and Chip
Media name/outlet	Global IP News. Semiconductor Patent News
Country/Territory	India
Date	09/30/22
URL	metabase.moreover.com/noarticleurl?type=psh&lni=66HC-DKH1-JBHT-D134-00000-00
Persons	Zhihua Liu