Equipments Details
Description
The PlasmaEtch Venus 50HF Plasma Chamber can be used for plasma cleaning, reactive ion etching (RIE), surface modification and activation, plasma bonding, and more.
125W 13.56 MHz power supply with automatic RF matching, dual gas controller, and automated processes sequencing
Process gasses: Oxygen, Argon, and/or CF4; Nitrogen purge
11.25W x 15D x 5H cm usable chamber space
125W 13.56 MHz power supply with automatic RF matching, dual gas controller, and automated processes sequencing
Process gasses: Oxygen, Argon, and/or CF4; Nitrogen purge
11.25W x 15D x 5H cm usable chamber space
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